Our soldering process is executed using controlled thermal joining methods that guarantee electrical continuity and mechanical strength. Temperature, duration, and solder alloy parameters are optimized in accordance with the conductor and terminal structure.
The process is conducted under strict control to minimize the risks of cold solder joints, void formation, and surface contamination. In critical applications, connection reliability is verified through microscopic inspection and pull tests.
Process Category
Electrical Joining Technologies
Standards
IPC-A-610 | IPC/WHMA-A-620 | Customer Specifications
Application Areas
Defense & Aerospace | Automotive | White Goods
Quality Control
Visual Inspection | Pull Test | Microscopic Control
